About this opportunity
Are you passionate about driving innovation and working on cutting edge 5G and 6G mobile communication solutions? Do you thrive in a flexible working culture, where new ideas are fostered and you are encouraged to develop new skills?
Then join Ericsson and our growing team in Rosenheim, Germany, as an expert for Semiconductor Packaging & Assembly!
We are working on all horizons: from the device technology to the package implementation, from novel designs and architectures to the end module prototype. The Device can cover all applicable power levels and frequency bands used for future mobile narrow band and broadband applications.
What you will do
Be part of a diverse and multi-functional team that is enthusiastic, to advance the state of the art in the area of highly integrated Multi Chip PA modules, Analog Front End modules and Digital IC packages
Lead efforts to identify and enable new process technologies based on project / product category needs
Work with various R&D teams to craft Ericsson’s future radio systems
Shape the capability setup of world leading characterization and prototyping facilities
Contribute to internal Process Roadmap and Assembly Design Rules
Work with innovation and adapt and respond to change
Plan and prioritize your work independently
Deliver results and meet customer expectations
You will bring
A Bachelor, Master or University Degree in Engineering preferably with an emphasis on microelectronics or equivalent
5+ years of proven experience within semiconductor packaging and test domain area are particularly advantageous
Full proficiency in English, both written and spoken
Proficiencies considered as a merit during the evaluation process
First-hand experience in Semiconductor Packaging Assembly processes such as Die Attach, Wire Bonding, Encapsulation / Molding, Soldering, Dispensing
Strong analytical and detailed problem-solving skills (8D, DMAIC), statistical knowledge (SPC, CpK analysis)
Ability to conduct Design of Experiments (DoE) / characterization for new process variants and develop / validate suitable process parameters
Very good understanding of common materials used in the Microelectronics Back End assembly
Ability of running engineering projects independently, practice systematic project / task management
Ability to anticipate issues and challenges and resolve them quickly. Good knowledge and skills in Back End production area
Experience with hybrid or multi-chip modules (MCM) or monolithic microwave integrated circuit (MMIC) packages is required
First level reliability (Knowledge of various failure modes, knowledge of application and respective reliability requirements and test standards)
Experience in defining / conducting final acceptance test procedures for Microelectronics Assembly equipment
What´s in it for you?
Here at Ericsson, our culture is built on over a century of courageous decisions. With us, you will no longer be dreaming of what the future holds – you will be redefining it. You won’t develop for the status quo but will build what replaces it. Joining us is a way to move your career in any direction you want; with hundreds of career opportunities in locations all over the world, in a place where co-creation and collaboration are embedded into the walls. You will find yourself in a speak-up environment where empathy and humanness serve as cornerstones for how we work, and where work-life balance is a priority. Welcome to an inclusive, global company where your opportunity to make an impact is endless.
What happens once you apply?
To prepare yourself for next steps, please explore here: https://www.ericsson.com/en/careers/job-opportunities/hiring-process

Ericsson provides equal employment opportunities (EEO) to all employees and applicants for employment without regard to race, color, religion, sex, sexual orientation, marital status, pregnancy, parental status, national origin, ethnic background, age, disability, political opinion, social status, veteran status, union membership or genetics.
Ericsson complies with applicable country, state and all local laws governing nondiscrimination in employment in every location across the world in which the company has facilities. In addition, Ericsson supports the UN Guiding Principles for Business and Human Rights and the United Nations Global Compact.
This policy applies to all terms and conditions of employment, including recruiting, hiring, placement, promotion, termination, layoff, recall, transfer, leaves of absence, compensation, training and development.
Ericsson expressly prohibits any form of workplace harassment based on race, color, religion, sex, sexual orientation, marital status, pregnancy, parental status, national origin, ethnic background, age, disability, political opinion, social status, veteran status, union membership or genetic information.