Package Health Engineer – Advanced Packaging

About the role

Micron is seeking a Package Health Engineer to lead monitoring, simulation, and characterization of advanced semiconductor packages. The role blends hands‑on DFT work, data analysis, and reliability testing to ensure robust packaging solutions for cutting‑edge memory and storage products.

Key responsibilities

• Develop and implement Design‑for‑Test (DFT) strategies for advanced packaging.
• Run mechanical, thermal, and electrical simulations to assess package performance.
• Perform electrical and mechanical characterization using test equipment.
• Analyze test and field data to detect early signs of package degradation.
• Collaborate with data scientists to build predictive health models.
• Support root‑cause analysis and corrective actions for reliability issues.

Required profile

• Bachelor’s or advanced degree in Engineering or Science.
• Strong analytical, logical, and critical‑thinking abilities.
• Effective communication and ability to work across teams.
• Growth mindset with a passion for continuous learning.
• Internship or experience in the semiconductor industry is a plus.
• Demonstrated leadership and impact are highly desirable.
• Interest in Micron’s semiconductor products and industry standards.

Required skills

• Python programming.
• MATLAB scripting.
• Visual Basic for automation.
• Simulation tools for mechanical, thermal, and electrical analysis.
• Test equipment for electrical and mechanical characterization.
• AI/ML or statistical modeling (preferred).
• Familiarity with JEDEC or other reliability standards (preferred).

What we offer

• Opportunity to work on innovative memory and storage technologies.
• Collaborative, inclusive environment focused on integrity and sustainability.
• Access to cutting‑edge tools and cross‑functional expertise.